![Temperature profile in the epoxy resin cure process. The upper right... | Download Scientific Diagram Temperature profile in the epoxy resin cure process. The upper right... | Download Scientific Diagram](https://www.researchgate.net/publication/221979933/figure/fig10/AS:668742358937614@1536452011794/Temperature-profile-in-the-epoxy-resin-cure-process-The-upper-right-figure-is-the.png)
Temperature profile in the epoxy resin cure process. The upper right... | Download Scientific Diagram
![Polymers | Free Full-Text | Accurate Cure Modeling for Isothermal Processing of Fast Curing Epoxy Resins Polymers | Free Full-Text | Accurate Cure Modeling for Isothermal Processing of Fast Curing Epoxy Resins](https://pub.mdpi-res.com/polymers/polymers-08-00390/article_deploy/html/images/polymers-08-00390-ag.png?1569119994)
Polymers | Free Full-Text | Accurate Cure Modeling for Isothermal Processing of Fast Curing Epoxy Resins
![Materials | Free Full-Text | Epoxy Resins Toughened with Surface Modified Epoxidized Natural Rubber Fibers by One-Step Electrospinning Materials | Free Full-Text | Epoxy Resins Toughened with Surface Modified Epoxidized Natural Rubber Fibers by One-Step Electrospinning](https://www.mdpi.com/materials/materials-10-00464/article_deploy/html/images/materials-10-00464-g006.png)
Materials | Free Full-Text | Epoxy Resins Toughened with Surface Modified Epoxidized Natural Rubber Fibers by One-Step Electrospinning
![Enhancing the Mechanical Toughness of Epoxy-Resin Composites Using Natural Silk Reinforcements | Scientific Reports Enhancing the Mechanical Toughness of Epoxy-Resin Composites Using Natural Silk Reinforcements | Scientific Reports](https://media.springernature.com/m685/springer-static/image/art%3A10.1038%2Fs41598-017-11919-1/MediaObjects/41598_2017_11919_Fig1_HTML.jpg)
Enhancing the Mechanical Toughness of Epoxy-Resin Composites Using Natural Silk Reinforcements | Scientific Reports
![Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide - RSC Advances (RSC Publishing) DOI:10.1039/C7RA13233F Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide - RSC Advances (RSC Publishing) DOI:10.1039/C7RA13233F](https://pubs.rsc.org/image/article/2018/RA/c7ra13233f/c7ra13233f-f7_hi-res.gif)